FSF series Filter

FSF-series Glass based SIW Filter

FSF series chip-level substrate integrated waveguide (SIW) filter is manufactured on DWMicrowave’s semiconductor process with glass substrate, which offers higher frequency band and better unloaded Q factor compared to silicon substrate.

DWMicrowave currently offers four filter product series designed for different frequency bands and performance requirements. Among these, the ZeroGuide series is currently under development, while the rest are already in mass production. Their microwave performance and cost are detailed in the figure below.

As shown in the figure above, the FSF-series filters are suitable for applications ranging from 20 GHz to 60 GHz, featuring extreme low insertion loss.

semi

Customized semiconductor process flow

Manufactured on semiconductor process, very high microwave performance consistency. Filters can be customized to meet specific user requirements

pim

Excellent PIM performance

By replacing the nickel with non-magnetic metal, The DWMicrowave’s FSF series filters provide outstanding PIM performance, which is close to the waveguide filters.

vac

Suitable for airtight and vacuum environments

The DWMicrowave’s FSF series filters, manufactured by specialized semiconductor process, are free from organic polymers, completely avoiding the out-gassing issues and are especially suitable for airtight or vacuum applications.

lowcte

Very low temperature drift

FSF series filter offers very low temperature drift. The table below provides the temperature coefficient of frequency (TCF) of the 21-23GHz FSF series filters.

Filter-CTE-en

Below are the basic parameters of the FSF22B2N5 filter. For the more detailed datasheet and S-parameter files, please contact us.

FSF22B2N5

  • Electrical Specifications

Data is measured with 2 wirebonds with approximately 25μm diameter, 50μm height, on the DWMicrowave test board. Test board is connected to VNA with 2.4mm connectors. The connector and coaxial cables are deembedded.

  • Typical Performance

  • Mechanical Drawing

mechanical_en

In the top view above, the shaded areas are for wire-bonding. Outline dimensions are given below, unit is millimeter.

For datasheets and S2P files of other chip models, please also contact us.